Circuit-forming substrate and circuit substrate
US6117616A · kind A · utility
4Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1996 |
| Grant date | Sep 12, 2000 |
| Priority date | — |
| Expiry date | Apr 16, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There are provided a circuit-forming substrate comprising a long stainless steel foil having formed on one surface or both surfaces thereof a polyimide resin layer wholly or partially, and a circuit substrate formed by using the circuit-forming substrate, wherein a conductor layer is finely patterned on the circuit-forming substrate. The circuit-forming substrate sufficiently satisfies low cost, high density and high reliability, scarcely causes warping of the substrate itself, and has excellent workability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.