Methods of producing integrated circuit devices
US6117707A · kind A · utility
71Cited by
19References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 29, 1996 |
| Grant date | Sep 12, 2000 |
| Priority date | — |
| Expiry date | Jul 29, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads and thereafter slicing the wafer, thereby to define a plurality of integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of the multiplicity of pads. Apparatus for carrying out the method and integrated circuit devices are also described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.