Wafer holder and method of producing a semiconductor wafer
US6117776A · kind A · utility
7Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1998 |
| Grant date | Sep 12, 2000 |
| Priority date | — |
| Expiry date | May 29, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer holder chuck has support for fixing a semiconductor wafer during nding. There is a method of producing a semiconductor wafer which has two flat-ground sides and a rounded edge. The wafer holder has a support which is composed of a soft material. The method has the semiconductor wafer fixed on a wafer holder having a soft support during grinding of the first side and has the wafer fixed on a wafer holder having a hard support during grinding of the second side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.