Low application temperature hot melt adhesive
US6117945A · kind A · utility
20Cited by
6References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1998 |
| Grant date | Sep 12, 2000 |
| Priority date | — |
| Expiry date | Feb 4, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from ethylene vinyl acetate with greater than 30 weight percent VA and having a melt index of at least 700; a thermoplastic hydrocarbon resin derived from styrene, alpha-methylstyrene, and/or vinyltoluene, and polymers, copolymers and terpolymers thereof; a compatible adhesive promoting tackifier; and wax with a melting point of about 130 to 170 .degree. F.; and optionally comprising ethylene vinyl acetate with less than about 30 weight percent by weight of vinyl acetate and having a melt index of about 400 to 2500.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.