Method of making a precision punch and die design and construction
US6119555A · kind A · utility
16Cited by
8References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 7, 1997 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | May 7, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/944
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A precision punch and die device for punching holes in a ceramic substrate and method of assembling the device. The device comprises a punch which moves relative to the substrate for punching a hole in the substrate and a die assembly including one or more precision die plates and support plates for guiding the punch and punching the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.