Method and apparatus for dispensing materials in a vacuum
US6119895A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1998 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Oct 8, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method and apparatus for dispensing materials onto a substrate in a vacuum. In one embodiment, a dispensing system includes a dispensing vacuum chamber having an inlet to receive substrates for dispensing and an outlet to provide substrates having material dispensed thereon, a dispensing pump, disposed within the dispensing vacuum chamber, that dispenses the material onto substrates, a substrate support system, disposed within the dispensing vacuum chamber, that supports substrates at a dispensing position beneath the dispensing pump, an inlet vacuum chamber coupled to the inlet of the dispensing vacuum chamber, and an outlet vacuum chamber coupled to the outlet of the dispensing vacuum chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.