Method for producing wire connections on semiconductor chips
US6119926A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1999 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Feb 10, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
On the production of wire connections (wire bonding) which start from a semiconductor chip and end on a substrate (2b) the capillary (12) guiding the wire (3) should be moved to an end section (s3) of its trajectory in a specific, programmed way in order to eliminate as far as possible reactions on the geometry of the wire bridge on bonding of the wire to the substrate and to produce flawless bond connections. The end section (s3) in which the capillary (12) moves slowly begins at a predetermined height (H) and ends on the substrate at the second connection point (5). In the end section (s3) the downward movement (vv) of the capillary is superimposed by a horizontal movement (vh) which is directed away from the already existing connection of the wire (3) to the chip and which continually decreases in relationship to the downward movement (vv).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.