Bipolar electrochemical connection of materials
US6120669A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 16, 1998 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Apr 16, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a bipolar electrochemical process for toposelective electrodeposition of a substance on a substrate comprising (a) placing the substrate and at least one of the substance and a source of the substance into an environment capable of conducting electricity and containing electrodes; (b) aligning the substrate on which the substance is to be deposited with respect to the electrodes such that the electrodes are not in contact with the substrate and the substance will be deposited in a predetermined location on the substrate when an electric field is applied; and (c) applying a voltage to the electrodes to create an electric field of a sufficient strength between the electrodes and for a time sufficient to deposit the substance on the substrate at the predetermined location in substantial alignment with the electric field. The toposelective electrodeposition of a substance preferably comprises forming a solid electrically conductive structure, such as a wire, between at least two substrates, such as metal particles. A thin wire is formed by a spatially coupled bipolar electrochemical mechanism. The ability to create electrical contacts between conductive…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.