Radiation-sensitive resin composition
US6120972A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 1998 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Aug 18, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/039
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A radiation-sensitive resin composition comprising (A) a copolymer which comprises (a) a repeating unit (I) formed by cleavage of a carbon--carbon double bond of a monomer having one polymerizable carbon--carbon double bond and (b) a repeating unit (II) formed by cleavage of a carbon--carbon double bond of a monomer having two or more polymerizable carbon--carbon double bonds and at least one divalent group decomposed by an acid of the following formulas (1) or (2), ##STR1## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are an alkyl group having 1-5 carbon atoms or an aryl group having 6-14 carbon atoms individually, said monomer having a structure in which each carbon--carbon double bond combines via said divalent group, and (B) a photoacid generator. The radiation-sensitive resin composition exhibits excellent sensitivity and resolution, fewer effect from the swing curves, excellent pattern profile, and superior heat resistance, high sensitivity to ultraviolet rays, far ultraviolet rays, X-rays, and various types of radiation such as charged particle rays, and is useful as a chemically amplified positive tone resist used in the manufacture of integrated circuit devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.