Method for removing accumulated solder from probe card probing features
US6121058A · kind A · utility
22Cited by
8References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 1998 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Jan 2, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07342
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for removing deposits from a probing feature of a probe card. The method includes the step of exposing the probing feature of a probe card to a composition that chemically reacts with the deposits on the probing feature to remove the deposits from the probing feature while not substantially effecting the material comprising the probing feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.