Process for producing semiconductor substrate by heat treating
US6121117A · kind A · utility
52Cited by
11References
175Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1998 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Jul 20, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing a semiconductor substrate comprises heat-treating a substrate having a monocrystal thereon in a reducing atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.