Abrasive articles comprising a fluorochemical agent for wafer surface modification
US6121143A · kind A · utility
123Cited by
70References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1997 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Sep 19, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention relates to fixed abrasive articles and abrasive constructions containing at least one fluorochemical agent. The fixed abrasive articles and abrasive constructions are used in semiconductor wafer surface modification processes during the fabrication of semiconductor devices. Specifically, fixed abrasive articles comprise an abrasive composite that is coextensive with a backing and at least one fluorochemical agent associated with the composite. The invention further relates to methods of making fixed abrasive articles comprising at least one fluorochemical agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.