Powderable reactive resin compositions
US6121348A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 18, 1998 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | May 18, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2363/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
1. A reactive resin composition, which is a fusible, solid optionally foamable, heat curable, epoxy functional reaction prouct with a Kofler Heat Bank melting point of not less than 55.degree. C., formed by mixing together PA1 (A) epoxy resins of epoxy group containing compounds PA1 (B) an amine solidifying system present in insufficient quantities to cause gelation after all the amino hydrogen atoms are consumed by epoxy groups, under the reaction conditions chosen for (A) and (B), and which yields a product with a Kofler Heat Bank melting point of greater than 55.degree. C. and less than 120.degree. C. and melting point stability of at least six months normal workshop temperatures, PA1 (C) a hardener system for (A) and the reaction product of (A) and (B) which is different from (B) and remains substantially unreacted under the conditions of reaction chosen for (A) and (B) with (A) and (B) and which is of low reactivity at normal workshop temperatures in the final solid epoxy formulation, optionally, PA1 (D) an expanding agent which is of low reactivity under the conditions of reaction chosen for (A) and (B) and which is of low reactivity at normal workshop temperatures in the fin…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.