Silicone composition and silicone pressure sensitive adhesive formed therefrom
US6121368A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 1999 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Sep 7, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/54
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A silicone composition for preparing a silicone pressure sensitive adhesive, the composition comprising (A) 20 to 55 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 45 to 80 parts by weight of an organopolysiloxane resin comprising R.sup.3.sub.3 SiO.sub.1/2 units and SiO.sub.4/2 units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups, the mole ratio of R.sup.3.sub.3 SiO.sub.1/2 units to SiO.sub.4/2 units is from 0.6:1 to 1.5:1, the resin contains less than about 2 mole percent of alkenyl groups, and the total amount of components (A) and (B) is 100 parts by weight; (C) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition; (D) a thixotropic agent in an amount sufficient to impart thixotropy to the composition; and (E) a catalytic amount of a hydrosilylation catalyst; wherein the sum of the average number of silicon-bonded alkenyl groups per molecule in component (A) and the average number of silicon-bonded hydr…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.