Circuit boards using heat resistant resin for adhesive layers
US6121553A · kind A · utility
87Cited by
5References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1997 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Oct 23, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An adhesive composition including (a) a polyamide-imide resin preferably having a molecular weight of 80,000 or more and (b) a thermosetting component preferably including an epoxy resin and a curing agent and/or a curing accelerator therefor is used for providing an insulating adhesive layer having a storage elastic modulus at 300.degree. C. of 30 MPa or more and a glass transition temperature of 180.degree. C. or higher. The insulating adhesive is suitable for use in wire scribed circuit boards, multilayer printed circuit boards, and circuit boards for chip carriers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.