Heat sink assembly
US6122169A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1999 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Oct 20, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly of the present invention comprises a conductive housing with a heat pipe and a fan fixed therein, and fixing devices. The conductive housing is formed by die-casting and comprises a base, a heat sink portion and a shielding portion which depend downwardly from the square base. The base defines a thorough channel to fix the heat pipe for dissipating heat produced by an electronic element mounted in the shielding portion, two legs of the channel being communication with the space formed by the shielding portion and the heat sink portion respectively. The shielding portion is integral with the heat sink portion and defines a peripheral side wall to form a sealed square-shaped space together with the base to provide EMI shielding for the electronic element. A hole is defined in each of the four corners of the peripheral side wall of the shielding portion to engage with the fixing devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.