Patent · US Expired

Apparatus and method for mounting micromechanical fluid control components

US6123107A · kind A · utility

28Cited by
2References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 9, 1999
Grant dateSep 26, 2000
Priority date
Expiry dateJul 9, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T137/87885
  • WIPO fieldMechanical elements
  • WIPO sectorMechanical engineering

Abstract

An apparatus for mounting micromechanical fluid control components includes a manifold interface plate adaptable for connection to a manifold substrate oriented in a horizontal plane. The manifold interface plate receives mounting stress forces from the manifold substrate along the horizontal plane. An orthogonal component plate is connected to the manifold interface plate in a vertical plane with respect to the horizontal plane of the manifold substrate. The orthogonal component plate includes an orthogonal mounting surface with a micromechanical fluid control component mounted on it. The position of the micromechanical fluid control component on the orthogonal mounting surface substantially isolates the micromechanical fluid control component from the mounting stress forces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.