Apparatus and method for soldering
US6123251A · kind A · utility
0Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 1999 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | Nov 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/304
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder head is adapted to direct the flow of solder from a solder fountain. The solder head includes a wall forming a passage through which solder can flow upwardly and having an edge portion over which solder can flow from the passage. The solder head also includes a shield connected to the wall. The shield and the wall at least partially define an overflow passage through which solder can flow downwardly. The shield is configured to prevent contact between solder and an electronic component adjacent the solder head. Corresponding soldering systems and soldering methods are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.