Conduit system for a valve array
US6123316A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1996 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | Nov 27, 2016 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16K2099/0084
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
Construction of fluid conduit systems in printed circuit boards or other dielectric laminate substrates is disclosed. The fluid conduits can be angled or curved to provide greater directional control of fluid flow. Conduits are created by lamination of a first laminate layer and a second laminate layer. The first laminate layer is composed of a dielectric base material impregnated with a resin, with a first aperture defined therethrough, while the second laminate layer has a second aperture. The second aperture is positioned with respect to the first aperture to only partially overlap, together defining an angled conduit. Fluid flow through the conduits can be controlled using microdevice valves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.