Scalable wide-array inkjet printhead and method for fabricating same
US6123410A · kind A · utility
80Cited by
13References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1997 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | Oct 28, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A scalable wide-array printhead is formed by mounting multiple thermal inkjet printheads to a carrier substrate. The printheads are mounted to one face and logic ICs and drive ICs are mounted to an opposite face. Interconnects are formed through the carrier substrate to electrically couple the printheads to the logic ICs and drive ICs. The carrier substrate is formed of silicon and etched to define ink refill slots. A solder bump mounting process is used to mount the printheads to the carrier substrate. Such process serves to align each of the printheads. The solder forms a fluidic boundary around a printhead ink slot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.