Device for applying adhesive spots on a substrate
US6123771A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 24, 1998 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | Sep 24, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0623
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device for simultaneous application of a plurality of adhesive spot s to a substrate, having a metering apparatus for conveying a predetermined volume of adhesive to a plurality of applicator nozzles for the application of respectively one adhesive spot to the substrate. A distribution apparatus distributes the volume of adhesive conveyed by the metering, device to the applicator nozzles. A warming medium is heated in a warning apparatus for heating the adhesive to a temperature desired for manipulation. The metering apparatus and the distribution apparatus are connected with each other by a conveying line containing an adhesive conduit. Feed lines with adhesive conduits lead from the distribution apparatus to the applicator nozzles, wherein a closed loop of the warming medium is formed, starting at the warming apparatus, and routed via the distribution apparatus and the feed lines to the applicator nozzles, and is returned via the feed lines and the distribution apparatus to the warming apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.