Process for treating semiconductor fabrication reclaim
US6123851A · kind A · utility
1Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1998 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | Apr 28, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC02F1/285
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
The hydrophilic organic contaminants and hydrogen peroxide present in semiconductor fabrication reclaims are removed by means of adsorption of a pyrolysate of a macroreticular sulphonated vinyl-aromatic polymer having a carbon content of at least 85% by weight and a carbon/hydrogen atomic ratio of from 1.5:1 to 20:1. In spite of their hydrophobic surface, the pyrolysates have a comparatively high adsorptivity for these contaminants and provide for distinctively higher removal rates than customary activated carbons.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.