Coating substrate
US6124039A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1998 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | Oct 5, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A coating substrate containing an aluminum or aluminum rolled alloy product for thin-film coatings for producing electronic components. The coating substrate prevents the interdiffusion of substrate elements and thin-film coating elements and enables the thin-film coatings to grow completely over irregularities. The local irregularities on the substrate surface to be coated, which have a maximum extension, measured vertically to the substrate surface, of less than 10 um and than 0.1 um, are such that the flanks of the local irregularities can be exposed to material deposition impinging on the substrate surface in a perpendicular manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.