High temperature epoxy resin compositions, additives and methods
US6124246A · kind A · utility
99Cited by
82References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1997 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | Nov 17, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K8/42
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Improved high temperature epoxy resin compositions, additives and methods are provided. A hardenable epoxy resin composition of the present invention is comprised of an epoxy resin, an aromatic diluent, a hardening agent and a hardening retarder for delaying the hardening of the epoxy composition at high temperatures comprised of a liquid which is soluble in the epoxy resin composition having a halide salt dissolved therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.