Patent · US Expired

Circuit board arrangement with accurately positioned components mounted thereon

US6125043A · kind A · utility

34Cited by

10References

16Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Heiner Hauer · Fellbach, DE
Albrecht Kuke · Auenwald, DE
Eberhard Moess · Murrhardt, DE
Werner Scholz · Duisburg, DE

Key dates

Filing date	Sep 15, 1998
Grant date	Sep 26, 2000
Priority date	—
Expiry date	Sep 15, 2018

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49144
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The circuit board (1) has a component (101) mounted on it by means of a soldering process which causes an automatic, passive alignment of the component (101) due to the surface tension in a melted piece of solder which electrically connects two pads (2, 102), one (102) of which is on the component and the other (2) of which is on the circuit board. Stand-offs (20) are used to provide a suitable spacing or distance between the component (101) and the circuit board (1). The other pad (2) has a surface that is divided into a central part (3) and an edge part (4), both wettable by the solder. The second or edge part (4) is shaped like a ring and surrounds the central part and is composed so that it is more slowly wettable by the solder than the central part. The spacing established by the stand-offs is dimensioned so that a melted piece of the solder between the pads produces a force drawing the component (101) toward the circuit board (1) because of surface tension in the melted solder.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.