Method of making wafer based sensors and wafer chip sensors
US6125529A · kind A · utility
3Cited by
26References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1997 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | Jun 17, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49101
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to making sensors by cutting pieces from a boule or ingot of a metal oxide single crystal. The sensors produced are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.