Integrated circuit packaging apparatus and method
US6126063A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1997 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | Aug 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/041
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for assembling solder balls in a selected one of several different patterns for delivery to connector pads on an integrated circuit package, or other receiver, includes a universal template containing holes at locations in an aggregate pattern of all hole locations for the several different patterns, and includes a subtemplate for each individual different pattern that contains posts at locations for insertion from the rear of the template into holes therein at locations where no surface recess is desired. The universal template may remain aligned with an assembly jig or holder of packages while only the subtemplate is changed to change the surface pattern of holes into which solder balls may then be distributed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.