Fluid jet printhead with integrated heat-sink
US6126276A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 1998 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | Mar 2, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1629
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A printhead used to eject fluid onto a recording medium has an integrated heat-sink which is used to cool the energy dissipation elements used to propel the fluid from the printhead. The printhead is comprised of a semiconductor substrate that has been processed with thin-film layers. On top of the thin-film layers is an orifice layer that has a pattern of orifices. Fluid feed channels, on the side of the printhead opposite the orifice, supply fluid to the pattern of orifices. Within the thin-film layers are energy dissipating elements which are used to transfer energy to the fluid thereby ejecting fluid from the orifice. The fluid is transferred to the orifice opening through fluid feed slots formed in the thin-film layer adjacent to the energy dissipation elements which is exposed in the fluid feed channel. An integrated heat-sink is attached to the energy dissipation elements to remove heat to the semiconductor substrate and the fluid supply in the fluid feed channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.