Method for resist removal, and adhesive or adhesive sheet for use in the same
US6126772A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1997 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | Dec 15, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/11
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An object is to peel off a disused resist from an article, e.g., a silicon wafer, with an adhesive sheet while preventing impurities contained in the adhesive sheet from transferring to the surface of the article, e.g., wafer, and from thus arousing electrical troubles resulting in problems such as decreases in the yield and reliability of the article. A method for resist removal comprising forming an adhesive layer on an article on which a resist is present and peeling the adhesive layer as a united sheet including the resist material from the article, characterized in that the adhesive layer has been regulated so as to have a modulus of elasticity of 1 Kg/mm.sup.2 or higher in the peeling, and an adhesive or an adhesive sheet both for use in the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.