Photosensitive resin compositions
US6127086A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1999 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | Sep 24, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0755
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive photosensitive resin composition comprising (a) a silane diol such as diarylsilane diol or dialkylsilane diol, (b) one or more capped polybenzoxazole precursors having the structure: ##STR1## wherein Ar.sub.1 is a tetravalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; Ar.sub.2 is a divalent aromatic, heterocyclic, alicyclic, or aliphatic group that optionally may contain silicon; Ar.sub.3 is divalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; PA1 Z is one of the following groups: ##STR2## x is 10 to 1000; y is 0 to 900; and b is 0.10 to 350; (c) a photosensitive agent, and (d) a solvent. The composition optionally includes an adhesion promoter, leveling agent, or mixtures thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.