Expandable resin composition
US6127441A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1999 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | Oct 22, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2423/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An expandable resin composition comprising: PA1 (A) 100 parts by weight of HDPE (high density polyethylene) having a DSC melting point of about 127 to about 136 degrees C.; a density of 0.945 to 0.967 gram per cubic centimeter; and a melt flow rate of about 0.1 to about 10 grams per 10 minutes, and for each 100 parts by weight of component (A), PA1 (B) about 2 to about 50 parts by weight of polypropylene having a DSC melting point of at least about 130 degrees C.; PA1 (C) about 50 to about 200 parts by weight of an ethylene/alpha-olefin copolymer, prepared with a metallocene catalyst, having a DSC melting point of about 98 to about 121 degrees C.; a density of 0.900 to 0.935 gram per cubic centimeter; and a melt flow rate of about 0.5 to about 3 grams per 10 minutes; PA1 (D) about 0.1 to about 5 parts by weight of a polysiloxane-polyether block copolymer having the following formula: EQU R.sub.3 --Si--O--R.sub.2 (SiO).sub.m --RX(SiO).sub.n --SiR.sub.3 PA1 wherein each R is independently a monovalent alkyl, alkoxy, hydroxy, aryl, or aralkyl group; PA2 X has the formula: --(CH.sub.2).sub.p --(O).sub.q --(C.sub.t H.sub.2t O).sub.s --R'; PA2 R' is the same as R above and (C.sub.t H.sub…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.