Thermoplastic resin composition and heat-resistant tray for IC
US6127492A · kind A · utility
76Cited by
1References
6Claims
0Family size
Assignee
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Key dates
| Filing date | May 11, 1999 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | May 11, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L81/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition in which 5 to 45 parts by weight of carbon fiber and 0.1 to 10 parts by weight of conductive carbon black are compounded per 100 parts by weight of resin components comprising an aromatic polycarbonate resin and an aromatic polysulfone resin. The thermoplastic resin composition is excellent in heat-resistance and mechanical strength, and heat-resistant IC trays therefrom are useful products which can endure drying of IC at high temperature and are excellent in handling properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.