High softening point, low molecular weight epoxy resin
US6127558A · kind A · utility
2Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 1998 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | May 5, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Epoxy resins which are diglycidyl ethers of tetrabromobisphenol A having a crystalline structure and in particulate form have an epoxy equivalent weight between 320 and 380 g/eq and a chlorine content that is smaller than 0.3%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.