Electroslag surfacing using wire electrodes
US6127644A · kind A · utility
8Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1999 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | Apr 27, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for depositing corrosion and wear resistant high alloy overlayers on industrial component substrates. Dilution of alloying components from out of the overlayer into the substrate is minimized by use of electroslag surfacing onto horizontally positioned surfaces of the substrate using oscillating wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.