Semi-conductor mounting apparatus for applying adhesive to a substrate
US6129040A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1998 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Aug 19, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/743
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for applying an adhesive pattern to a chip mounting surface by means of an adhesive dispensing head movable in z, y, and z dimensions, contains a first carriage, which is movable in x and y dimensions using first and second actuators. A second carriage with a dispensing head is movable in the z dimension, perpendicular to the chip mounting surface, on a guide mounted on the first carriage. A third actuator is provided with a positioning motor mounted in a stationary manner and an auxiliary carriage displaceable in the z direction. The auxiliary carriage, driven by the positioning motor, runs in a stationary guide. The auxiliary carriage has a positioning surface parallel to the chip mounting surface and a stop, the stop kept in constant contact with the positioning surface. Preferably, this contact is a gliding contact retained by a spring. The apparatus has good dynamic properties which make possible a rapid "drawing" of adhesive patterns with a high degree of precision.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.