Reflow furnace for an electronic assembly
US6129256A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1999 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Sep 21, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a reflow furnace for an electronic assembly. The electronic assembly comprises a printed circuit board and a device on the printed circuit board. The printed circuit board has solder at a first area near the device and a metallic surface at second area distant from the device. The furnace comprises a frame, a support, a heater, and a shield. The support is secured to the frame and is capable of holding the printed circuit board. The heater is secured to the frame and is capable of heating the printed circuit board while being held by the support. The shield is secured to the frame and is positioned to prevent solder from migrating from the first area to the metallic surface at the second area while the printed circuit board is being heated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.