Compound dip process for metal cans
US6129494A · kind A · utility
2Cited by
11References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1997 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Aug 20, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D7/36
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Sealant is applied onto or into a folded-seam closure of a metal can. Instead of introducing sealant into the U-shaped lid flange and drying, according to the invention the compound or sealant is applied to the base flange, the base of the metal can being dipped into a current of fluid sealant or at least brought into contact with it at the surface. This substantially improves the precision of dosing and the exact amount of applied sealant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.