Patent · US Expired

Method for achieving a wear performance which is as linear as possible and tool having a wear performance which is as linear as possible

US6129609A · kind A · utility

7Cited by

14References

5Claims

0Family size

Assignee

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

Bert Ripper · Postbauer-Heng, DE
Robert Hofmann · Berlin, DE
Peter Lehfeld · Burghausen, DE
Holger Lundt · Burghausen, DE

Key dates

Filing date	Nov 3, 1998
Grant date	Oct 10, 2000
Priority date	—
Expiry date	Nov 3, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/30625
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Material removing machining is for wafer shaped workpieces, in particular semiconductor wafers. There is a method for achieving a wear performance which is as linear as possible for a tool which has an essentially planar working surface for the material removing machining of wafer shaped workpieces. The tool has a wear performance which is as linear as possible. There are also a method and a device for measuring a wear profile on an essentially planar working surface for the material removing machining of wafer shaped workpieces. There is also a carrier which is used for the two-sided material removing machining of wafer shaped workpieces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.