Process for the electrolytic deposition of copper layers

US6129830A · kind A · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Gerd Senge · Berlin, DE
• Wolfgang Dahms · Berlin, DE

Key dates

• Filing date: Jun 2, 1999
• Grant date: Oct 10, 2000
• Expiry date: Jun 2, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/423
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A process with the following process steps is used to electrolytically deposit copper layers, especially on printed circuit boards. An electrically-conductive substrate and anodes that decompose upon electrolytic deposition are brought into contact with a deposition bath. The deposition bath contains copper ions, compounds that increase the electrical conductivity of the deposition bath, additives to influence the material properties of the copper layers, additional compounds of an electrochemically reversible redox system, and solvents or solvent mixtures. The substrate and the electrodes are connected to a power supply. The copper layers are deposited on the substrate using a pulsed current or a pulsed voltage process. When this process is used, metal layers with favorable visual and mechanical material properties are deposited after a brief bath preparation time.