Radiation-curable resin composition
US6130270A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jan 6, 1999 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Jan 6, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2323/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A radiation curable composition comprising, PA0 (A) at least one compound containing a (meth)acrylate group represented by the following formula (1), ##STR1## wherein R.sup.1 is a hydrogen atom or a methyl group, R.sup.2 is an alkylene group or a hydroxyalkylene group having 2 to 6 carbon atoms, R.sup.3 is a divalent organic group, n is a number of 1 to 10, m is an integer of 0 or 1, and Ar.sup.1 and Ar.sup.2 are independently a group comprising an aromatic ring PA0 (B) at least one compound derived from trishydroxyethyl isocyanurate, and containing at least one (meth)acrylate group, and PA0 (C) at least one radiation polymerization initiator. The radiation curable resin composition affords a high productivity, exhibits high transparency, and produces molded articles exhibiting minimal coloration upon exposure to light, superior dimensional precision, high heat resistance, only slight adhesion to substrates under high temperature conditions. The composition is very useful for manufacturing molding articles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.