Optical sensor package and method of making same
US6130448A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1998 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Aug 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package that encapsulates an integrated circuit optical sensor and mounts on a support substrate includes a base substrate constructed of an insulating material. The optical sensor bottom surface is bonded to the base substrate top surface. Conductive strips on the base substrate top surface extend from a region near the optical sensor to an edge of the base substrate top surface. Wires are bonded on one end to a sensor bonding pad for which connection is desired and on the other end to a corresponding conductive strip. A window is bonded to the base substrate top surface in a spaced-apart relationship using seal material extending around the sensor enclosing each wire bond. Various means are provided for connecting each conductive strip to a corresponding trace on the support substrate. An electrochromic variable attenuator may be formed on the window, allowing control over the intensity of light striking the optical sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.