Polymer stud grid array for microwave circuit arrangements
US6130478A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Apr 18, 1998 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Apr 18, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A polymer stud grid array for microwave circuits is proposed which includes an injection-molded, three-dimensional substrate that is fabricated from an electrically insulating polymer. The substrate includes a plurality of polymer studs which are arranged over the underside of the substrate and which are integrally formed with the substrate during the injection-molding process. Signal connections are formed on the studs which include an end surface that is capable of being soldered. Potential connections are formed on at least one of the studs. The potential connection also includes an end surface that is capable of being soldered. Striplines are also constructed which connect the studs to the microwave circuit. Each stripline includes a first structured metal layer disposed on the underside of the substrate, a dielectric layer disposed on the first metal layer and a second structured metal layer disposed on top of the dielectric layer. The first metal layer is electrically connected to the potential connection. The second metal layer connects the signal connections to an associated internal connection which is connected to the microwave circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.