Semiconductor device
US6130484A · kind A · utility
25Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 1997 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Dec 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a buffer region having buffers and disposed along a side of a semiconductor chip; a pad region having pads corresponding to the buffers and disposed outside the buffer region on the semiconductor chip; signal lines connecting the buffers to corresponding pads; and power supply lines and ground lines connected to extra pads, either of the power supply lines or the ground lines being partially superimposed on part of and separated from the signal lines by insulating layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.