Near field magneto-optical head made using wafer processing techniques
US6130779A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1998 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Jul 6, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B11/1058
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method of making and self-aligning a magneto-optical head at a wafer level is as follows: A flat optical substrate is molded or heat pressed in batches as a wafer level to form the desired lens shapes. Coil cavities or depressions are simultaneously formed with the lens to accommodate the coil assembly. Conductive plugs are formed in proximity to the cutting lines, for wire bonding attachment to the coil. The plugs are filled with a conductive material such as copper. The plugs do not extend through the entire depth of the optical wafer, thus further facilitating the mass production of the integrated heads. The slider body wafer is formed from silicon or other appropriate material. The slider body wafer and the lens/coil wafer are bonded. Coils and pedestals are formed on the lens / coil plate using thin-film processing techniques. Reflective surfaces are deposited on the bottom surface of the substrate, opposite the lens. The mirror material around the pedestal areas and plugs is masked and removed. An alumina layer is then deposited to define the air bearing surface and the pedestal. Yokes are then formed by means of lithography and plating in the base and sides of the depres…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.