Stackable ball grid array module and method
US6130823A · kind A · utility
64Cited by
9References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1999 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Feb 1, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stackable ball grid array module in which a chip select decoder is used to reduce the number of busses required for communication between modules. Additional modules may be added without requiring additional interconnect lines in the array. Cooling of the individual modules may be accomplished using a support member made from an enhanced heat transfer material or placing an enhanced heat transfer material layer between the modules. The devices on the module may be encapsulated, and the modules may be constructed in a chip first or cavity-down configuration. Methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.