Method of planarizing first pole piece layer of write head by lapping without delamination of first pole piece layer from wafer substrate
US6131271A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1999 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | Jun 25, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49046
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method planarizes a first pole piece layer of a write head by lapping without delaminating the first pole piece layer from an underlying second read gap layer on a wafer substrate. This is accomplished by separating or dicing the first pole piece material layer in a field region about rows and columns of first pole piece layers of magnetic head assemblies so as to reduce the stress of the first pole piece material layer in the field. Accordingly, when the wafer substrate is lapped, such as by chemical mechanical polishing (CMP), a reduced stress prevents the first pole piece material layer from delaminating from the second read gap layer during the lapping operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.