Minimal thermal expansion, high thermal conductivity metal-ceramic matrix composite
US6132676A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jun 30, 1997 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | Jun 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides techniques for forming composites including XW.sub.2 O.sub.8, where X=Zr, Hf, or a combination, dispersed within a continuous, metal matrix. A low to zero coefficient of thermal expansion material, with high thermal and electrical conductivity, results. One method for forming the composite involves coating particles of XW.sub.2 O.sub.8 with a layer of metal, then isostatically pressing the particles under conditions amenable to formation of a composite. The technique of coating, with a more malleable phase, a phase that undergoes a disadvantageous phase transformation of decomposition upon exposure to a threshold pressure at a set temperature can be applied to a variety of materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.