Miniature low cost modular assembly package and method of assembly
US6133525A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1998 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | Jun 1, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modular miniature circuit built entirely within the case of the module without a primary printed circuit board conventionally used as a bottom support for the circuit component. The circuit components are mounted on the inside of the case and the leads of the components are attached directly to the module's terminals, greatly reducing lead inductance. The elimination of the primary PC board results in a substantial reduction in cost and physical size and the reduction in lead lengths results in a significant enhancement of high frequency performance. The "flip chip" construction provides a flat surface for pick up by automatic assembly equipment without the added cost of a cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.