Resin sealing type semiconductor device that includes a plurality of leads and method of making the same
US6133623A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1998 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | Feb 25, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin sealing type semiconductor device comprises an element mounting member (10) having an element mounting surface (12), a semiconductor element (20) bonded to the element mounting surface (12), a plurality of leads (30) provided and separated from the semiconductor element (20), a frame lead (36) disposed between these leads (30) and the semiconductor element (20), various wires (40) and a resin sealing portion which seals the element mounting member (10), the semiconductor element (20), parts of the leads (30) and the frame lead (36). The leads (30) include first inner leads (32a) disposed discontinuously with the frame lead (36) and second leads (32b) disposed integrally with the frame lead (36). The resin sealing type semiconductor device has good heat radiation characteristics and high reliability. Wire bonding with a highly flexible wiring arrangement design is provided by using leads commonly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.