Semiconductor device having a plurality of semiconductor chips
US6133637A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 1998 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | Sep 18, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes first and second semiconductor chips. The first semiconductor chip is formed with a plurality of first electrodes on a surface thereof, while the second semiconductor chip is formed with a plurality of second electrodes on a surface thereof. These surfaces are positioned facing to each other, thereby connecting between the first electrode and the second electrode. The respective surfaces are formed with circuit elements. The circuit elements are covered by the first semiconductor chip and the second semiconductor chip The first semiconductor chip and the second semiconductor chip at their connecting portions are encapsulated by a synthetic resin that is excellent in moisture resistance. The first semiconductor chip and the second semiconductor chip are entirely packaged by a second synthetic resin that is excellent in adhesibility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.